产品中心
3D AOI mainly uses 3D camera scanning and depth imaging technology to automatically detect various defects on large chipboards, such as damage, missing, pollution and wrong soldering of components.
Technical parameters:
Fully automatic testing system, automatic loading and unloading
High precision motion module
Defect detection type: missing, damaged, polluted, wrong soldering, etc. of components
Product application:
Defect Detection Process of Large Semiconductor PCB
Suitable for mass production
